2007.06.27

公司成立,注册资金2500万元RMB,总投资5000万RMB

The company was established, registered capital of 25 million yuan RMB, with a total investment of 50 million RMB

2008.03 通过ISO9001:2000质量管理体系认证 Through the ISO9001:2000 quality management system certification

2008.06 通过UL认证 Certified by UL

2009.03 通过ISO14001:2004环境管理体系认证 Through the ISO14001:2004 environmental management system certification

2009.07 公司新产品“用于手机触摸屏并带有ACP导电胶的镂空/双面结合柔性印制电路板”被纳入“2009年昆山市工业科技项目”之中2009.07 new products for mobile phone touch screen with ACP conductive adhesive with hollow / double-sided flexible printed circuit board "was included in the" industrial science and technology project of Kunshan city in 2009.

2012.07 荣获高新企业称号 Awarded the title of high-tech enterprises

2012.12 厂房面积11000平方米员工300人 产能20000平米/月

Plant area of 11000 square meters employees 300 people capacity of 20000 square meters / month

2013 制作FPC阻抗板技术突破,可大批量生产, 购买了AOI,TDR,LCR等精密设备, 增加了一条新的DES线 企业资产过亿RMB2013 FPC impedance board technology breakthrough, mass production, purchase of AOI, TDR, LCR and other precision equipment, added a new line of business RMB DES billions of dollars of assets

2015 增加VCP 连续环形电镀线和化软金线The increase of VCP continuous circular electroplating line and soft gold